Optical Interconnects and Packaging (OIP) Conference

Optical Interconnects and Packaging (OIP) ConferenceOptical Interconnects and Packaging (OIP) ConferenceOptical Interconnects and Packaging (OIP) Conference

Fort Collins, Colorado

June 15 - 17 , 2026

Navigating Communication and Packaging Challenges in the AI Era

Optical Interconnects and Packaging (OIP) Conference

Optical Interconnects and Packaging (OIP) ConferenceOptical Interconnects and Packaging (OIP) ConferenceOptical Interconnects and Packaging (OIP) Conference

Fort Collins, Colorado

June 15 - 17 , 2026

Navigating Communication and Packaging Challenges in the AI Era

Bringing Together Our Multidisciplinary Field

Our Mission

Experts from multidisciplinary fields in a dedicated single-track setting problem solving the future of interconnects and electro-optical packaging:

Photonics devices (IPC, OFC, ECOC)
Optical interconnects & packaging (OFC, ECTC)
Electronic packaging (ECTC, Designcon)
SerDes & I/O (ISSCC, Designcon)
Socket and connectors (ECTC, Designcon)

Keynote Speakers

Chairs

Jock Bovington

Conference Co-Chair

Cisco

Mahdi Nikdast

Jock Bovington

Conference Co-Chair

Colorado State University

Ali Ghiasi

Liron Gantz

Technical Program Co-Chair

Ghiasi Quantum

Liron Gantz

Technical Program Co-Chair

Nvidia

OIP'25 Technical and Financial Sponsors

OIP 2026

Better yet, see us in person!

OIP Conference, The Elizabeth Hotel

111 Chestnut Street, Fort Collins, Colorado 80524, United States

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