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Optical Interconnects and Packaging (OIP) Conference

Optical Interconnects and Packaging (OIP) ConferenceOptical Interconnects and Packaging (OIP) ConferenceOptical Interconnects and Packaging (OIP) Conference

Fort Collins, Colorado

June 15 - 17 , 2026

Navigating Communication and Packaging Challenges in the AI Era

Optical Interconnects and Packaging (OIP) Conference

Optical Interconnects and Packaging (OIP) ConferenceOptical Interconnects and Packaging (OIP) ConferenceOptical Interconnects and Packaging (OIP) Conference

Fort Collins, Colorado

June 15 - 17 , 2026

Navigating Communication and Packaging Challenges in the AI Era

OIP is almost here!

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Bringing Together Our Multidisciplinary Field

Our Mission

Experts from multidisciplinary fields in a dedicated single-track setting problem solving the future of interconnects and electro-optical packaging:


  • Photonics devices (IPC, OFC, ECOC) 
  • Optical interconnects & packaging (OFC, ECTC)
  • Electronic packaging (ECTC, Designcon)
  • SerDes & I/O (ISSCC, Designcon)
  • Socket and connectors (ECTC, Designcon)

Keynote Speakers

Bill Dally, NVIDIA Chief Scientist and SVP Research

Ram Huggahalli, Principal Hardware Engineer at Microsoft

Ram Huggahalli, Principal Hardware Engineer at Microsoft

In a career spanning nearly four decades, Dally has pioneered many of the fundamental technologies underlying today’s supercomputer and networking architectures. As head of NVIDIA Research, he leads a team of more than 300 around the globe who are inventing technologies for a wide variety of applications, including AI, HPC, graphics and n

In a career spanning nearly four decades, Dally has pioneered many of the fundamental technologies underlying today’s supercomputer and networking architectures. As head of NVIDIA Research, he leads a team of more than 300 around the globe who are inventing technologies for a wide variety of applications, including AI, HPC, graphics and networking.

Prior to joining NVIDIA in 2009 as chief scientist and senior vice president of research, he chaired Stanford University’s computer science department for some four years.

Dally is a member of the National Academy of Engineering and a fellow of the American Academy of Arts & Sciences, the Institute of Electrical and Electronics Engineers and the Association for Computing Machinery.

He’s written four textbooks, published more than 250 papers and holds over 120 patents, and has received the IEEE Seymour Cray Award, ACM Eckert-Mauchly Award and ACM Maurice Wilkes Award.

Ram Huggahalli, Principal Hardware Engineer at Microsoft

Ram Huggahalli, Principal Hardware Engineer at Microsoft

Ram Huggahalli, Principal Hardware Engineer at Microsoft

Ram Huggahalli is a Principal Hardware Engineer in Microsoft’s Azure Hardware and Systems Infrastructure organization. As part of the Strategic Planning and Architecture function within this organization, he leads the Optical Technology Pathfinding team that is evaluating emerging optical technologies for AI and Cloud DC applications. Pri

Ram Huggahalli is a Principal Hardware Engineer in Microsoft’s Azure Hardware and Systems Infrastructure organization. As part of the Strategic Planning and Architecture function within this organization, he leads the Optical Technology Pathfinding team that is evaluating emerging optical technologies for AI and Cloud DC applications. Prior to this role, Ram was part of the Microsoft Cobalt processor team contributing to its I/O architecture. Ram also worked for Intel on many projects spanning memory, server networking and large scale HPC fabrics with contributions to Intel Xeon processors and Omni-Path Architecture. Ram holds 20 patents and a Masters degrees in Electrical Engineering and Engineering Management from the University of Missouri.

Chairs

Jock Bovington

Jock Bovington

Jock Bovington

Conference Co-Chair 

Cisco

Mahdi Nikdast

Jock Bovington

Jock Bovington

Conference Co-Chair

 Colorado State University


Ali Ghiasi

Liron Gantz

Liron Gantz

Technical Program Co-Chair

Ghiasi Quantum

Liron Gantz

Liron Gantz

Liron Gantz

Technical Program Co-Chair

Nvidia

OIP'26 Technical and Financial Sponsors

OIP 2026

Better yet, see us in person!

OIP Conference, The Elizabeth Hotel

111 Chestnut Street, Fort Collins, Colorado 80524, United States

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