• Home
  • Paper Submission
  • Program
  • Venue, Hotel and Travel
  • Registration
  • About
  • More
    • Home
    • Paper Submission
    • Program
    • Venue, Hotel and Travel
    • Registration
    • About
  • Home
  • Paper Submission
  • Program
  • Venue, Hotel and Travel
  • Registration
  • About

OIP 2026 Program

Schedule

To access the full conference program and schedule please click here (coming soon!).

To access the conference handout, including all the abstracts and bios, please click here (password protected; coming soon!). 


Registration: There will be no onsite registration. The registration desk to collect name badge, OIP handout, etc. is located in the main lobby at the Elizabeth Hotel, and will be open from 8 AM to 3 PM during the conference.  


Keynote Speakers

Tom Gray, Senior Director Circuit Research at NVIDIA

Ram Huggahalli, Principal Hardware Engineer at Microsoft

Tom Gray, Senior Director Circuit Research at NVIDIA

C. Thomas Gray received the B.S. degree in computer science and mathematics from Mississippi College, Clinton, MS and the M.S. and Ph.D. degrees in computer engineering from North Carolina State University, Raleigh, NC. From 1993 to 1998, he was an Advisory Engineer with IBM, Research Triangle Park, NC working on transceiver design for co

C. Thomas Gray received the B.S. degree in computer science and mathematics from Mississippi College, Clinton, MS and the M.S. and Ph.D. degrees in computer engineering from North Carolina State University, Raleigh, NC. From 1993 to 1998, he was an Advisory Engineer with IBM, Research Triangle Park, NC working on transceiver design for communication systems. From 1998 to 2004, he was a Senior Staff Design Engineer with the Analog/Mixed Signal Design Group, Cadence Design Systems, working on SerDes system architecture. From 2004 to 2010, he was a Consultant Design Engineer with Artisan/ARM and Technical Lead of SerDes architecture and design. In 2010, he joined Nethra Imaging as a System Architect. His work experience includes digital signal processing design and CMOS implementation of DSP blocks as well as high-speed serial link communication systems, architectures, and implementation. In 2011, he joined NVIDIA, Inc., Durham, NC where he is currently Senior Director of Circuit Research leading activities related to high-speed electrical signaling, photonics, security circuits, low-energy and resilient memories, circuits for machine learning, variation-tolerant clocking, and power delivery.

Emily Kinser, Program Director at DOE ARPA-E

Ram Huggahalli, Principal Hardware Engineer at Microsoft

Tom Gray, Senior Director Circuit Research at NVIDIA

Dr. Emily Kinser currently serves as a Program Director at the Advanced Research Projects Agency-Energy (ARPA E).  Her focus at ARPA-E is on sensors and semiconductor technologies, including 3D Integration and silicon photonics.

Dr. Kinser began her career at IBM where she worked in a number of roles, including as a semiconductor engineer,

Dr. Emily Kinser currently serves as a Program Director at the Advanced Research Projects Agency-Energy (ARPA E).  Her focus at ARPA-E is on sensors and semiconductor technologies, including 3D Integration and silicon photonics.

Dr. Kinser began her career at IBM where she worked in a number of roles, including as a semiconductor engineer, patent engineer, and research strategist; she has 69 patents to date and was named “IBM Master Inventor” in 2015.  Her personal research focused on nano-scale surface engineering for biomaterials and nanopatterned biosensors.  Prior to joining ARPA-E, Emily worked at 3M Corporate Research as the Director of the Inorganics, Ceramics, and Applied Physics Lab.  She is active in the materials professional societies ASM & TMS and was named ASM Fellow in 2023.

Dr. Kinser earned a Bachelor of Arts in Political Science and a Bachelor of Science and Master of Science in Materials Science & Engineering from Iowa State University. She earned her Ph.D. in Mechanical Engineering & Materials Science at Yale. 

Ram Huggahalli, Principal Hardware Engineer at Microsoft

Ram Huggahalli, Principal Hardware Engineer at Microsoft

Ram Huggahalli, Principal Hardware Engineer at Microsoft

Ram Huggahalli is a Principal Hardware Engineer in Microsoft’s Azure Hardware and Systems Infrastructure organization. As part of the Strategic Planning and Architecture function within this organization, he leads the Optical Technology Pathfinding team that is evaluating emerging optical technologies for AI and Cloud DC applications. Pri

Ram Huggahalli is a Principal Hardware Engineer in Microsoft’s Azure Hardware and Systems Infrastructure organization. As part of the Strategic Planning and Architecture function within this organization, he leads the Optical Technology Pathfinding team that is evaluating emerging optical technologies for AI and Cloud DC applications. Prior to this role, Ram was part of the Microsoft Cobalt processor team contributing to its I/O architecture. Ram also worked for Intel on many projects spanning memory, server networking and large scale HPC fabrics with contributions to Intel Xeon processors and Omni-Path Architecture. Ram holds 20 patents and a Masters degrees in Electrical Engineering and Engineering Management from the University of Missouri.

Invited Speakers

Venkata Mokkapati

Steven Verhaverbeke

Steven Verhaverbeke

Director Business Development & Application Engineering, AT&S, Austria

Steven Verhaverbeke

Steven Verhaverbeke

Steven Verhaverbeke

Senior Director, Applied Materials, USA

John Calvin

Steven Verhaverbeke

Matthew Sysak

Senior Strategic Planer, Keysight, USA

Matthew Sysak

Matthew Sysak

Matthew Sysak

VP and CTO, Lumentum, USA

John Jost

Matthew Sysak

Preet Virk

Co-Founder and Co-CEO, Enlightra, Switzerland

Preet Virk

Matthew Sysak

Preet Virk

SVP, G, Marvell Technology, USA

Katharine Schmidtke

Siamak Amiralizadeh

Siamak Amiralizadeh

Co-Founder, Edible Systems, USA

Siamak Amiralizadeh

Siamak Amiralizadeh

Siamak Amiralizadeh

Optical Engineer, Meta, USA

Kannan Raj

Siamak Amiralizadeh

Kannan Raj

Technical Architect, Oracle, USA

Al Yuen

Louis-Rafaël Robichaud

Kannan Raj

Founder and CEO, PicoJool, USA

Kazutaka Takeda

Louis-Rafaël Robichaud

Louis-Rafaël Robichaud

Fuji Film, Japan

Louis-Rafaël Robichaud

Louis-Rafaël Robichaud

Louis-Rafaël Robichaud

CEO and Co-Founder, Femtum, Canada

Kovendhan Vijayan

Kovendhan Vijayan

Kovendhan Vijayan

Research Scientist, Nokia Bell Labs, USA

Gernot Fasching

Kovendhan Vijayan

Kovendhan Vijayan

Director Silicon Photonics, Huawei, Belgium

Wolfgang Heni

Kovendhan Vijayan

Wolfgang Heni

Co-Founder, Polariton Technologies, Switzerland

Yun Gao

Tetsuya Nakanishi

Wolfgang Heni

Senior Staff Silicon Photonics Development Engineer, Lumentum, USA

S. J. Ben Yoo

Tetsuya Nakanishi

Tetsuya Nakanishi

 Distinguished Professor, UC Davis, USA 

Tetsuya Nakanishi

Tetsuya Nakanishi

Tetsuya Nakanishi

 Manager, Sumitomo Electric Industries,  Japan 

Joyce Poon

Kazuhiko Tsurui

Martin Vallo

Professor, University of Toronto, Canada

Martin Vallo

Kazuhiko Tsurui

Martin Vallo

Senior Analyst, Yole Group, France

Kazuhiko Tsurui

Kazuhiko Tsurui

Masayoshi Nishimoto

Senior Principal Researcher, Ajinomoto Co., USA

Masayoshi Nishimoto

Masayoshi Nishimoto

Masayoshi Nishimoto

Deputy Marketing Manager, Resonac Corp. Japan

Satoru Kuramochi

Masayoshi Nishimoto

Satoru Kuramochi

Dai Nippon Printing (DNP), Japan

Nicholas Psaila

Masayoshi Nishimoto

Satoru Kuramochi

Principal Engineer and Technology Development Manager, Intel, USA

Angélique Raley

Carlos E. Osornio Martinez

Carlos E. Osornio Martinez

Sr. Director of Technology, Tokyo Electron US (TEL), USA

Carlos E. Osornio Martinez

Carlos E. Osornio Martinez

Carlos E. Osornio Martinez

Integrated Photonics Engineer, Aluvia Photonics, Netherlands

Sajjad Moazzeni

Carlos E. Osornio Martinez

Sajjad Moazzeni

Assistant Professor, University of Washington, USA

Richard Penty

Amir H. Hosseinnia

Sajjad Moazzeni

Professor, University of Cambridge, UK

Amir H. Hosseinnia

Amir H. Hosseinnia

Amir H. Hosseinnia

Lightwave Logic, USA

Eric Snow

Amir H. Hosseinnia

Amir H. Hosseinnia

Test Fellow, GlobalFoundries, USA

Alexander William Setiawan Putra

Alexander William Setiawan Putra

Alexander William Setiawan Putra

Hakusan Inc., Japan

Takaaki Ishugure

Alexander William Setiawan Putra

Alexander William Setiawan Putra

Professor, Keio University, Japan

Mike Li

Alexander William Setiawan Putra

Di Liang

Senior Fellow, AMD, USA

Di Liang

Kaushik Patel

Di Liang

Professor, University of Michigan, USA

Kaushik Patel

Kaushik Patel

Kaushik Patel

VP Photonics & Silicon Engineering, Lightmatter, USA

Subal Sahni

Kaushik Patel

Kaushik Patel

VP, Technology, Marvell, USA

Joris Van Campenhout

Joris Van Campenhout

Joris Van Campenhout

Program Director Optical I/O, imec

Sam Kocsis

Joris Van Campenhout

Joris Van Campenhout

Director of Standards and Technology, Amphenol, USA

Workshops and Panels

WS1: Reporting Energy Efficiency

WS2: Substrates, Materials, and the Rise of Co-Packaged Optics

WS2: Substrates, Materials, and the Rise of Co-Packaged Optics

Speakers

Coming soon!

WS2: Substrates, Materials, and the Rise of Co-Packaged Optics

WS2: Substrates, Materials, and the Rise of Co-Packaged Optics

WS2: Substrates, Materials, and the Rise of Co-Packaged Optics

Speakers

Coming soon!

WS3: Overcoming CPO Manufacturing Challenges at Scale!

WS2: Substrates, Materials, and the Rise of Co-Packaged Optics

WS3: Overcoming CPO Manufacturing Challenges at Scale!

Speakers

Coming soon!

Important Dates

April 10, 2026

Paper submission deadline (firm deadline)

April 10, 2026

Paper submission deadline (firm deadline)

March 23, 2026

Conference Registration Open

March 23, 2026

Conference Registration Open

May 22, 2026

Early conference registration close

May 22, 2026

Early conference registration close

June 15, 2026

OIP conference starts

June 15, 2026

OIP conference starts

Copyright © 2025 OIP Conference - All Rights Reserved.

This website uses cookies.

We use cookies to analyze website traffic and optimize your website experience. By accepting our use of cookies, your data will be aggregated with all other user data.

Accept