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    • Home
    • Paper Submission
    • Program
    • Venue, Hotel and Travel
    • Registration
    • About
  • Home
  • Paper Submission
  • Program
  • Venue, Hotel and Travel
  • Registration
  • About

OIP 2026 Program

Schedule

To access the full conference program and schedule please click here! 


To access the conference handout, including all the abstracts and bios, please click here (password protected). 


OIP 2026 is welcoming four exhibitors (visit them at Chestnut):

  • Nagase ChemteX - Japan
  • IEEE Electronics Packaging Society (EPS) - United States
  • Femtum - Canada
  • Optalysys - United Kingdom


Registration: There will be no onsite registration. The registration desk to collect name badge, OIP handout, etc. is located in the main lobby at the Elizabeth Hotel, and will be open from 7:30 AM to 3 PM during the conference.  


Venue

Keynote Speakers

Tom Gray, Senior Director Circuit Research at NVIDIA

Ram Huggahalli, Principal Hardware Engineer at Microsoft

Ram Huggahalli, Principal Hardware Engineer at Microsoft

C. Thomas Gray received the B.S. degree in computer science and mathematics from Mississippi College, Clinton, MS and the M.S. and Ph.D. degrees in computer engineering from North Carolina State University, Raleigh, NC. From 1993 to 1998, he was an Advisory Engineer with IBM, Research Triangle Park, NC working on transceiver design for co

C. Thomas Gray received the B.S. degree in computer science and mathematics from Mississippi College, Clinton, MS and the M.S. and Ph.D. degrees in computer engineering from North Carolina State University, Raleigh, NC. From 1993 to 1998, he was an Advisory Engineer with IBM, Research Triangle Park, NC working on transceiver design for communication systems. From 1998 to 2004, he was a Senior Staff Design Engineer with the Analog/Mixed Signal Design Group, Cadence Design Systems, working on SerDes system architecture. From 2004 to 2010, he was a Consultant Design Engineer with Artisan/ARM and Technical Lead of SerDes architecture and design. In 2010, he joined Nethra Imaging as a System Architect. His work experience includes digital signal processing design and CMOS implementation of DSP blocks as well as high-speed serial link communication systems, architectures, and implementation. In 2011, he joined NVIDIA, Inc., Durham, NC where he is currently Senior Director of Circuit Research leading activities related to high-speed electrical signaling, photonics, security circuits, low-energy and resilient memories, circuits for machine learning, variation-tolerant clocking, and power delivery.

Ram Huggahalli, Principal Hardware Engineer at Microsoft

Ram Huggahalli, Principal Hardware Engineer at Microsoft

Ram Huggahalli, Principal Hardware Engineer at Microsoft

Ram Huggahalli is a Principal Hardware Engineer in Microsoft’s Azure Hardware and Systems Infrastructure organization. As part of the Strategic Planning and Architecture function within this organization, he leads the Optical Technology Pathfinding team that is evaluating emerging optical technologies for AI and Cloud DC applications. Pri

Ram Huggahalli is a Principal Hardware Engineer in Microsoft’s Azure Hardware and Systems Infrastructure organization. As part of the Strategic Planning and Architecture function within this organization, he leads the Optical Technology Pathfinding team that is evaluating emerging optical technologies for AI and Cloud DC applications. Prior to this role, Ram was part of the Microsoft Cobalt processor team contributing to its I/O architecture. Ram also worked for Intel on many projects spanning memory, server networking and large scale HPC fabrics with contributions to Intel Xeon processors and Omni-Path Architecture. Ram holds 20 patents and a Masters degrees in Electrical Engineering and Engineering Management from the University of Missouri.

Di Liang, University of Michigan

Ram Huggahalli, Principal Hardware Engineer at Microsoft

Di Liang, University of Michigan

Di Liang is a Professor of Electrical and Computer Engineering at the University of Michigan, Ann Arbor. Prior to joining academia, he served as a Director at Alibaba Cloud Computing (US) to lead the development of silicon photonic 100G/lane DR4/DR8 transceiver product in 2021-2023. From 2009 to 2021, he was a research scientist at Hewlet

Di Liang is a Professor of Electrical and Computer Engineering at the University of Michigan, Ann Arbor. Prior to joining academia, he served as a Director at Alibaba Cloud Computing (US) to lead the development of silicon photonic 100G/lane DR4/DR8 transceiver product in 2021-2023. From 2009 to 2021, he was a research scientist at Hewlett Packard Labs and led advanced research in heterogeneous integrated photonics for energy-efficient optical interconnects in high-performance computing systems. He has (co-)authored one edited book, seven book chapters, over 360 journal and conference publications, and over 10,000 citations. He holds more than 70 issued patents, with several dozen pending. He is a Fellow of the IEEE and Optica. 

Invited Speakers

Venkata Mokkapati

Steven Verhaverbeke

Steven Verhaverbeke

Director Business Development & Application Engineering, AT&S, Austria

Steven Verhaverbeke

Steven Verhaverbeke

Steven Verhaverbeke

Senior Director, Applied Materials, USA

John Calvin

Steven Verhaverbeke

Oleg Shchekin

Senior Strategic Planer, Keysight, USA

Oleg Shchekin

Ankur Aggarwal

Oleg Shchekin

 Head of High-Density Interconnect, Lumentum, USA 

John Jost

Ankur Aggarwal

Ankur Aggarwal

Co-Founder and Co-CEO, Enlightra, Switzerland

Ankur Aggarwal

Ankur Aggarwal

Ankur Aggarwal

VP of Adv. Packaging and Supply Chain, Marvel, USA

Katharine Schmidtke

Siamak Amiralizadeh

Siamak Amiralizadeh

Co-Founder, Edible Systems, USA

Siamak Amiralizadeh

Siamak Amiralizadeh

Siamak Amiralizadeh

Optical Engineer, Meta, USA

Kannan Raj

Siamak Amiralizadeh

Kannan Raj

Technical Architect, Oracle, USA

Al Yuen

Louis-Rafaël Robichaud

Kannan Raj

Founder and CEO, PicoJool, USA

Kazutaka Takeda

Louis-Rafaël Robichaud

Louis-Rafaël Robichaud

Fuji Film, Japan

Louis-Rafaël Robichaud

Louis-Rafaël Robichaud

Louis-Rafaël Robichaud

CEO and Co-Founder, Femtum, Canada

Kovendhan Vijayan

Kovendhan Vijayan

Kovendhan Vijayan

Research Scientist, Nokia Bell Labs, USA

Gernot Fasching

Kovendhan Vijayan

Kovendhan Vijayan

Director Silicon Photonics, Huawei, Belgium

Wolfgang Heni

Kovendhan Vijayan

Wolfgang Heni

Co-Founder, Polariton Technologies, Switzerland

Yun Gao

Tsutaru Kumagai

Wolfgang Heni

Senior Staff Silicon Photonics Development Engineer, Lumentum, USA

S. J. Ben Yoo

Tsutaru Kumagai

Tsutaru Kumagai

 Distinguished Professor, UC Davis, USA 

Tsutaru Kumagai

Tsutaru Kumagai

Tsutaru Kumagai

 Assistant Manager, Sumitomo Electric Industries (SEI), Japan 

Joyce Poon

Kazuhiko Tsurui

Martin Vallo

Professor, University of Toronto, Canada

Martin Vallo

Kazuhiko Tsurui

Martin Vallo

Senior Analyst, Yole Group, France

Kazuhiko Tsurui

Kazuhiko Tsurui

Masayoshi Nishimoto

Senior Principal Researcher, Ajinomoto Co., USA

Masayoshi Nishimoto

Masayoshi Nishimoto

Masayoshi Nishimoto

Deputy Marketing Manager, Resonac Corp. Japan

Satoru Kuramochi

Masayoshi Nishimoto

Satoru Kuramochi

Dai Nippon Printing (DNP), Japan

Nicholas Psaila

Masayoshi Nishimoto

Satoru Kuramochi

Principal Engineer and Technology Development Manager, Intel, USA

Angélique Raley

Carlos E. Osornio Martinez

Carlos E. Osornio Martinez

Sr. Director of Technology, Tokyo Electron US (TEL), USA

Carlos E. Osornio Martinez

Carlos E. Osornio Martinez

Carlos E. Osornio Martinez

Integrated Photonics Engineer, Aluvia Photonics, Netherlands

Sajjad Moazzeni

Carlos E. Osornio Martinez

Sajjad Moazzeni

Assistant Professor, University of Washington, USA

Richard Penty

Richard Penty

Sajjad Moazzeni

Professor, University of Cambridge, UK

Manoj Manjare

Richard Penty

Manoj Manjare

Lightwave Logic, USA

Eric Snow

Richard Penty

Manoj Manjare

Test Fellow, GlobalFoundries, USA

Alexander William Setiawan Putra

Alexander William Setiawan Putra

Alexander William Setiawan Putra

Hakusan Inc., Japan

Takaaki Ishugure

Alexander William Setiawan Putra

Alexander William Setiawan Putra

Professor, Keio University, Japan

Mike Li

Alexander William Setiawan Putra

Di Liang

Senior Fellow, AMD, USA

Di Liang

Kaushik Patel

Di Liang

Professor, University of Michigan, USA

Kaushik Patel

Kaushik Patel

Kaushik Patel

VP Photonics & Silicon Engineering, Lightmatter, USA

Subal Sahni

Kaushik Patel

Kaushik Patel

VP, Technology, Marvell, USA

Yoojin Ban

Pirooz Hojabri

Sam Kocsis

Technology Director, imec

Sam Kocsis

Pirooz Hojabri

Sam Kocsis

Director of Standards and Technology, Amphenol, USA

Pirooz Hojabri

Pirooz Hojabri

Armands Ostrovskis

CEO, IC Photonics, USA

Armands Ostrovskis

Armands Ostrovskis

Armands Ostrovskis

Keysight, Germany

Halil Cirit

Armands Ostrovskis

Massimo Sorbara

 SerDes & Systems Architect, Meta, USA

Massimo Sorbara

Armands Ostrovskis

Massimo Sorbara

DMTS - High Speed Serial & Optical Links, GlobalFoundries, USA

Workshops and Panels

WS1: Reporting Energy Efficiency

WS2: Substrates, Materials, and the Rise of Co-Packaged Optics

WS2: Substrates, Materials, and the Rise of Co-Packaged Optics

Tom Gray, Nvidia

John Jost, Elightra 

Oleg Maksimov, Lumentum

Masayoshi Nishimoto, Resonac  

WS2: Substrates, Materials, and the Rise of Co-Packaged Optics

WS2: Substrates, Materials, and the Rise of Co-Packaged Optics

WS2: Substrates, Materials, and the Rise of Co-Packaged Optics

Venkata Mokkapati, AT&S AG

Steven Verhaverbeke, Applied Materials 

Martin Vallo, Yole Group 

Kazuhiko Tsurui, Ajinomoto 

Masayoshi Nishimoto, Resonac

Satoru Kuramochi, Dai Nippon Printing (DNP) 

Nicholas PsailaIntel, Intel

Pirooz Hojabri, IC Photonics 

WS3: Overcoming CPO Manufacturing Challenges at Scale!

WS2: Substrates, Materials, and the Rise of Co-Packaged Optics

WS3: Overcoming CPO Manufacturing Challenges at Scale!

Eric Snow, GlobalFoundries

 Angelique Raley, TEL

  Ankur Aggarwal , Marvel

Kaushik Patel, LightMatter

Armands Ostrovskis, Keysight 


Important Dates

April 10, 2026

Paper submission deadline (firm deadline)

April 10, 2026

Paper submission deadline (firm deadline)

March 23, 2026

Conference Registration Open

March 23, 2026

Conference Registration Open

May 22, 2026

Early conference registration close

May 22, 2026

Early conference registration close

June 15, 2026

OIP conference starts

June 15, 2026

OIP conference starts

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