About OIP Conference

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Optical interconnects and advanced packaging technologies are rapidly transforming the landscape of high-performance computing (HPC) and data communication. With applications spanning HPC, data centers, telecommunications, sensing, and aerospace, these technologies have drawn significant interest from both academia and industry. The development of next-generation optical interconnects requires a multidisciplinary approach, integrating innovations in materials, photonic device engineering, packaging solutions, and system-level design. As the demand for higher bandwidth, lower power consumption, and scalable architectures continues to grow, collaboration across disciplines becomes essential to unlock the full potential of optical interconnects and packaging solutions.

The IEEE Optical Interconnects and Packaging (OIP) Conference—formerly known as Optical Interconnects (OI) Conference—is a single track, collaborative event dedicated to solving the future of high-density optical interconnects and packaging including evolving applications in 

• High speed 200G/400G SerDes
• Energy efficient high density scale up/out interconnects
• Optical packaging and 3D-IC integration
• Next generation optical devices enabling high speed/low power

Our mission is to advance all these fields through high-quality technical presentations as well as workshops, invited talks, and keynotes while fostering in-person interactions in an interdisciplinary setting. OIP gathers experts from both industry and academia and multiple fields, including SerDes, optical devices/interconnects, HPC, and packaging. 

Shared Interdisciplinary experience—missing in current IEEE/Optica large conferences

• Single-track event creates a more focused and collaborative environment for experts from different fields.
• Majority of OIP program consists of invited talks by well-known industry and academic leaders.
• OIP offers unique panels and workshops to foster meaningful discussions. 
• OIP hosts keynote talks to draw high-profile attendees. 
• OIP offers multiple opportunities for graduate students and for networking with industry stakeholders through contributed papers and student poster sessions.