OIP Conference
About OIP mission
The IEEE Optical Interconnects and Packaging Conference is a single track collaborative event dedicated to solving the future of high-density electro-optical interconnects and packaging including the evolving applications in:
- High speed SerDes
- Energy efficient interconnects
- Optical packaging
- Electro-optical circuits and packages
▸ Our mission is to advance all of these fields through high quality technical presentations and in-person interactions in an interdisciplinary setting.
▸ Always relevant: OIP focuses on identifying and solving looming bottlenecks for next-gen systems interconnect and packaging
▸Shared Interdisciplinary experience—missing in current IEEE/OSA large conferences
-Single track event creates a focused and collaborative event.
-Majority of OIP program consist of invited talks by well-known industry leaders
-Panels and workshops to generate discussion
-Keynote talks to attract big-name attendees
-Opportunities for grad student/academic networking with industry through contributed papers and student poster session.