• Home
  • Paper Submission
  • Program
  • Venue, Hotel and Travel
  • Registration
  • About
  • More
    • Home
    • Paper Submission
    • Program
    • Venue, Hotel and Travel
    • Registration
    • About
  • Home
  • Paper Submission
  • Program
  • Venue, Hotel and Travel
  • Registration
  • About

Optical Interconnects and Packaging (OIP) Conference

Optical Interconnects and Packaging (OIP) ConferenceOptical Interconnects and Packaging (OIP) ConferenceOptical Interconnects and Packaging (OIP) Conference

Santa Barbara, California

April 26 - 28 , 2027

Navigating Communication and Packaging Challenges in the AI Era

Optical Interconnects and Packaging (OIP) Conference

Optical Interconnects and Packaging (OIP) ConferenceOptical Interconnects and Packaging (OIP) ConferenceOptical Interconnects and Packaging (OIP) Conference

Santa Barbara, California

April 26 - 28 , 2027

Navigating Communication and Packaging Challenges in the AI Era

OIP is almost here!

00

DaysDays

00

HrsHours

00

MinsMinutes

00

SecsSeconds

Bringing Together Our Multidisciplinary Field

Our Mission

Experts from multidisciplinary fields in a dedicated single-track setting problem solving the future of interconnects and electro-optical packaging:


  • Photonics devices (IPC, OFC, ECOC) 
  • Optical interconnects & packaging (OFC, ECTC)
  • Electronic packaging (ECTC, Designcon)
  • SerDes & I/O (ISSCC, Designcon)
  • Socket and connectors (ECTC, Designcon)

Keynote Speakers (coming soon!)

Chairs

Jock Bovington

Jock Bovington

Jock Bovington

Conference Co-Chair 

Cisco

Mahdi Nikdast

Jock Bovington

Jock Bovington

Conference Co-Chair

 Colorado State University


Clint Schow

Jock Bovington

Clint Schow

Conference Co-Chair

UCSB

Ali Ghiasi

Farhang Yazdani

Clint Schow

Technical Program Co-Chair

Ghiasi Quantum

Liron Gantz

Farhang Yazdani

Farhang Yazdani

Technical Program Co-Chair

Nvidia

Farhang Yazdani

Farhang Yazdani

Farhang Yazdani

Technical Program Co-Chair

BroadPak

Faezeh Gholami

Takako Hirokawa

Faezeh Gholami

Technical Program Co-Chair

IBM

Stephen Ralph

Takako Hirokawa

Faezeh Gholami

Technical Program Co-Chair

Georgia Tech

Takako Hirokawa

Takako Hirokawa

Takako Hirokawa

Workshop Co-Chair

GlobalFoundries

OIP'26 Technical and Financial Sponsors

OIP 2027

Better yet, see us in person!

OIP Conference, Hilton Santa Barbara Beachfront Re

633 E Cabrillo Blvd, Santa Barbara, CA 93103

Contact us

Attach Files
Attachments (0)

This site is protected by reCAPTCHA and the Google Privacy Policy and Terms of Service apply.

Cancel

Copyright © 2025 OIP Conference - All Rights Reserved.

This website uses cookies.

We use cookies to analyze website traffic and optimize your website experience. By accepting our use of cookies, your data will be aggregated with all other user data.

Accept