Optical Interconnects and Packaging (OIP) Conference
Optical Interconnects and Packaging (OIP) ConferenceOptical Interconnects and Packaging (OIP) ConferenceOptical Interconnects and Packaging (OIP) Conference
Fort Collins, Colorado
June 15 - 17 , 2026
Navigating Communication and Packaging Challenges in the AI Era
Optical Interconnects and Packaging (OIP) Conference
Optical Interconnects and Packaging (OIP) ConferenceOptical Interconnects and Packaging (OIP) ConferenceOptical Interconnects and Packaging (OIP) Conference
Fort Collins, Colorado
June 15 - 17 , 2026
Navigating Communication and Packaging Challenges in the AI Era
OIP is almost here!
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Bringing Together Our Multidisciplinary Field
Our Mission
Experts from multidisciplinary fields in a dedicated single-track setting problem solving the future of interconnects and electro-optical packaging:
Photonics devices (IPC, OFC, ECOC)
Optical interconnects & packaging (OFC, ECTC)
Electronic packaging (ECTC, Designcon)
SerDes & I/O (ISSCC, Designcon)
Socket and connectors (ECTC, Designcon)
Keynote Speakers
Bill Dally, NVIDIA Chief Scientist and SVP Research
Ram Huggahalli, Principal Hardware Engineer at Microsoft
Bill Dally, NVIDIA Chief Scientist and SVP Research
In a career spanning nearly four decades, Dally has pioneered many of the fundamental technologies underlying today’s supercomputer and networking architectures. As head of NVIDIA Research, he leads a team of more than 300 around the globe who are inventing technologies for a wide variety of applications, including AI, HPC, graphics and n
In a career spanning nearly four decades, Dally has pioneered many of the fundamental technologies underlying today’s supercomputer and networking architectures. As head of NVIDIA Research, he leads a team of more than 300 around the globe who are inventing technologies for a wide variety of applications, including AI, HPC, graphics and networking.
Prior to joining NVIDIA in 2009 as chief scientist and senior vice president of research, he chaired Stanford University’s computer science department for some four years.
Dally is a member of the National Academy of Engineering and a fellow of the American Academy of Arts & Sciences, the Institute of Electrical and Electronics Engineers and the Association for Computing Machinery.
He’s written four textbooks, published more than 250 papers and holds over 120 patents, and has received the IEEE Seymour Cray Award, ACM Eckert-Mauchly Award and ACM Maurice Wilkes Award.
Emily Kinser, Program Director at DOE ARPA-E
Ram Huggahalli, Principal Hardware Engineer at Microsoft
Bill Dally, NVIDIA Chief Scientist and SVP Research
Dr. Emily Kinser currently serves as a Program Director at the Advanced Research Projects Agency-Energy (ARPA E). Her focus at ARPA-E is on sensors and semiconductor technologies, including 3D Integration and silicon photonics.
Dr. Kinser began her career at IBM where she worked in a number of roles, including as a semiconductor engineer,
Dr. Emily Kinser currently serves as a Program Director at the Advanced Research Projects Agency-Energy (ARPA E). Her focus at ARPA-E is on sensors and semiconductor technologies, including 3D Integration and silicon photonics.
Dr. Kinser began her career at IBM where she worked in a number of roles, including as a semiconductor engineer, patent engineer, and research strategist; she has 69 patents to date and was named “IBM Master Inventor” in 2015. Her personal research focused on nano-scale surface engineering for biomaterials and nanopatterned biosensors. Prior to joining ARPA-E, Emily worked at 3M Corporate Research as the Director of the Inorganics, Ceramics, and Applied Physics Lab. She is active in the materials professional societies ASM & TMS and was named ASM Fellow in 2023.
Dr. Kinser earned a Bachelor of Arts in Political Science and a Bachelor of Science and Master of Science in Materials Science & Engineering from Iowa State University. She earned her Ph.D. in Mechanical Engineering & Materials Science at Yale.
Ram Huggahalli, Principal Hardware Engineer at Microsoft
Ram Huggahalli, Principal Hardware Engineer at Microsoft
Ram Huggahalli, Principal Hardware Engineer at Microsoft
Ram Huggahalli is a Principal Hardware Engineer at Microsoft and leads the Platform and Physical Technologies team in enabling new technologies for future AI and General-Purpose compute platforms. Among the various exciting projects, his team is evaluating optical interconnect technologies for AI Scale-up communication and memory disaggre
Ram Huggahalli is a Principal Hardware Engineer at Microsoft and leads the Platform and Physical Technologies team in enabling new technologies for future AI and General-Purpose compute platforms. Among the various exciting projects, his team is evaluating optical interconnect technologies for AI Scale-up communication and memory disaggregation use cases. Ram has previously contributed to Microsoft's Cobalt 100 and Cobalt 200 processors as an IO and platform architect. Prior to Microsoft, Ram was the lead performance architect for Intel's large-scale HPC interconnect products. Ram has over 20 patents and graduated with an MS in Electrical Engineering and Engineering Management at the University of Missouri.
Chairs
Jock Bovington
Jock Bovington
Jock Bovington
Conference Co-Chair
Cisco
Mahdi Nikdast
Jock Bovington
Jock Bovington
Conference Co-Chair
Colorado State University
Clint Schow
Jock Bovington
Clint Schow
Conference Co-Chair
UCSB
Ali Ghiasi
Farhang Yazdani
Clint Schow
Technical Program Co-Chair
Ghiasi Quantum
Liron Gantz
Farhang Yazdani
Farhang Yazdani
Technical Program Co-Chair
Nvidia
Farhang Yazdani
Farhang Yazdani
Farhang Yazdani
Technical Program Co-Chair
BroadPak
Faezeh Gholami
Takako Hirokawa
Faezeh Gholami
Technical Program Co-Chair
IBM
Stephen Ralph
Takako Hirokawa
Faezeh Gholami
Technical Program Co-Chair
Georgia Tech
Takako Hirokawa
Takako Hirokawa
Takako Hirokawa
Workshop Co-Chair
GlobalFoundries
OIP'26 Technical and Financial Sponsors
OIP 2026
Better yet, see us in person!
OIP Conference, The Elizabeth Hotel
111 Chestnut Street, Fort Collins, Colorado 80524, United States
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