Submit your papers to OIP 2025

OIP will be held as an in-person conference in Fort Collins, CO during June 16 – 18, 2025. Original, unpublished papers describing research and advancements in the following areas are solicited:

• T1 - Co-packaging and optical integration
• T2 - Materials for optical  interconnects and packaging
• T3 - Light sources
• T4 - Photonic devices
• T5 - Advanced optical design solutions (inverse design, AI-assisted design, etc.)
• T6 - Advanced system architectures (chiplet-based systems, disaggregated systems, etc.)
• T7 - 2.5D and 3D   integration
• T8 - AI-driven optical interconnects
• T9 - High-volume   manufacturing, assembly, and testing
• T10 - Electronics for   photonics (SerDes, TIAs, etc.)
• T11 - Packaging technologies   (panel-/wafer-level packaging & integration, etc.)
• T12 - Emerging applications of photonics (quantum, AI, autonomous systems, etc.)

Paper  submission: Authors are invited to submit full-length 2-page, original, camera-ready and unpublished papers along with an abstract of at most 45 words. The 2-page paper should include author names and information and be prepared based on the  IEEE paper template. Charts, illustrations, and figures must fit within the 2-page paper limit. The 45-word abstract will be used in the online program. The IEEE Xplore proceedings will only contain accepted papers that are presented at the conference. 

Note: Authors of accepted papers must agree to IEEE Copyright policies, for including papers in OIP proceedings. Please read more here. Copyright information will be collected after the paper notification date.

Important dates 

• Paper submission deadline April 14, 2025 (firm deadline)
• Acceptance Notification May 5, 2025

Call for Papers (PDF)